Services & Package Offerings




Leadframe Packages


SOIC / SOIC-EP / SOIC EIAJ

The SOIC 8, 14L are designed commonly used for communication networks, computer and automotive system. The (EP) Exposed pad are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch.

System In Package SiP

The System in Package (SiP) designed commonly used for voltage regulator. Contained within the package are all the active and passive components for a high efficiency step-down switching regulator.

PDIP

The PDIP 8, 14, 16L are commonly used for integrated circuits include resistor networks, DIP switches and electromechanical relays. Increasingly complex circuits will required more leads than could be put on these packages.

PLCC

The PLCC32, 44L are used for wide variety of devices particularly suited for memory, processor, controllers, ASIC, DSP, etc. These IC packages has a “J” lead configuration requires less board space.

TSSOP

The TSSOP 8 are particularly suited for controllers, wireless / memories module, cellular, analog, ASIC and PC cards. These IC packages has a thinner lead pitch than standard SOP.




Leadless Packages


DFN

(T) DFN 1.6 x 1.6 x 0.75 – 6
(T) DFN 2.0 x 2.0 x 0.75 – 6, 8
(T) DFN 2.0 x 3.0 x 0.75 – 6, 8
(T) DFN 2.0 x 5.0 x 0.75 – 6
(T) DFN 3.0 x 2.0 x 0.75 – 6
(T) DFN 3.0 x 3.0 x 0.75 – 6, 8, 10, 12
(T) DFN 3.3 x 3.3 x 0.75 – 8
(T) DFN 3.0 x 4.8 x 0.75 – 8
(T) DFN 4.0 x 4.0 x 0.75 – 8, 16
(T) DFN 5.0 x 6.0 x 0.75 – 8

(UT) DFN 1.0 x 1.0 x 0.5 – 4
(UT) DFN 1.2 x 1.6 x 0.5 – 4
(UT) DFN 2.0 x 2.0 x 0.5 – 8
(UT) DFN 2.0 x 3.0 x 0.5 – 8
(UT) DFN 3.0 x 3.0 x 0.5 – 10

(VT) DFN 1.5 x 1.5 x 0.6 – 6, 8
(SUT) DFN 0.3 x 0.6 x 0.3 - 2

QFN

(T) QFN 2.0 x 2.0 x 0.75 – 12
(T) QFN 3.0 x 3.0 x 0.75 – 12, 16, 20
(T) QFN 3.5 x 3.5 x 0.75 – 14
(T) QFN 4.0 x 4.0 x 0.75 – 16, 20, 24, 28
(T) QFN 5.0 x 4.0 x 0.75 – 18
(T) QFN 5.0 x 5.0 x 0.75 – 24, 32, 40
(T) QFN 5.0 x 6.0 x 0.75 – 28
(T) QFN 5.2 x 6.2 x 0.75 – 32
(T) QFN 6.0 x 6.0 x 0.75 – 40, 48
(T) QFN 7.0 x 7.0 x 0.75 – 48
(T) QFN 8.0 x 8.0 x 0.75 – 56
(T) QFN 9.0 x 9.0 x 0.75 – 64
(T) QFN 13.0 x 13.0 x 0.75 – 108
                       
(UT) QFN 1.6 x 1.6 x 0.5 – 8
(UT) QFN 4.0 x 4.0 x 0.5 – 20

(VT) QFN 2.0 x 2.0 x 0.6 – 12
            

The Dual / Quad Flat no-leads, also known as (MLF) Micro lead-frame, is a surface-mount technology. These package offer a variety of benefits including reduced lead inductance, a small sized footprint, thin profile and low weight. The exposed cooper die-pad technology offers good thermal and electrical performance. These features make the QFN and DFN an ideal choice for many new applications where size, weight, thermal and electrical performance are crucial.




MEMS Packages


MEMS 14L (WITHOUT PORT)

The MEMS 14L (TPMS) Tire Pressure Monitoring System is an electronics system are designed to monitor the air pressure inside the pneumatic tires on various type of vehicles. The high pressure sensor is enabling to function on real-time and indicate tire-pressure reading to the driver.

MEMS 14L (WITH PORT)

The MEMS 14L also designed for (CPAP) Continuous Positive Airway Pressure Machine. The low pressure sensor is enabling to diagnose, treat or help manage sleep-disordered breathing or other respiratory conditions.




SmartCard / RFID Packages


SMARTCARD

The Smartcard or integrated circuit card (ICC) is a pocket-sized card that has embedded integrated circuits, commonly serve as credit cards or ATM cards. Contact-type smartcard may have many different contact pad layouts design.

RFID

The radio frequency identification (RFID) tags are designed for data/ink cartridges in order to prevent unauthorized refilling of used ink cartridges. RFID is been used in variety applications such as access management, tracking of goods & logistic, airport baggage and etc.




Process Capability





Test Equipment, Reliability and FA Capabilities






Reliability & FA Services






Gallery