Packages Portfolio
Latest Packages
RD91
Features • High current SCR • High commutation capability • Low thermal resistance with clip bonding • Insulated package RD91 high power: • Low thermal resistance with clip bonding • Insulated voltage: 2500 Vrms • Complies with UL 1557 (File ref : E81734) • RoHS (2002/95/EC) compliant Applications • Solid state relays • Welding equipment • High power motor control
TO218/TO220
Features • High current Triac • Low thermal resistance with clip bonding • Standard commutation (4 quadrants) or snubberless (3 quadrants), high turn-off commutation • BTA26 UL 1557 recognized components (file ref: 81734) • RoHS (2022/95/EC) compliant packages Applications • On/off function in static relays, heating regulation, induction motor starting circuits. • Phase control operations in light dimmers and motor speed controllers.
Lead Packages
SOIC / SOIC-EP / SOIC EIAJ
The SOIC 8, 14L are designed commonly used for communication networks, computer and automotive system. The (EP) Exposed pad are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch.
SMA
Features • For surface mounted application • Glass passivated junction chip • Built-in strain relief, ideal for automated placement • Plastic material used carries Underwriters Laboratory Classification 94V-O • Fast Switching for high efficiency • High temperature soldering: 250°C/10 seconds at terminals
Leadless Packages
DFN
(T) DFN 1.6 x 1.6 x 0.75 – 6 (T) DFN 2.0 x 2.0 x 0.75 – 6, 8 (T) DFN 2.0 x 3.0 x 0.75 – 6, 8 (T) DFN 2.0 x 5.0 x 0.75 – 6 (T) DFN 3.0 x 2.0 x 0.75 – 6 (T) DFN 3.0 x 3.0 x 0.75 – 6, 8, 10, 12 (T) DFN 3.3 x 3.3 x 0.75 – 8 (T) DFN 3.0 x 4.8 x 0.75 – 8 (T) DFN 4.0 x 4.0 x 0.75 – 8, 16 (T) DFN 5.0 x 6.0 x 0.75 – 8 (UT) DFN 1.0 x 1.0 x 0.5 – 4 (UT) DFN 1.2 x 1.6 x 0.5 – 4 (UT) DFN 2.0 x 2.0 x 0.5 – 8 (UT) DFN 2.0 x 3.0 x 0.5 – 8 (UT) DFN 3.0 x 3.0 x 0.5 – 10 (VT) DFN 1.5 x 1.5 x 0.6 – 6, 8 (SUT) DFN 0.3 x 0.6 x 0.3 - 2
QFN
(T) QFN 2.0 x 2.0 x 0.75 – 12
(T) QFN 3.0 x 3.0 x 0.75 – 12, 16, 20
(T) QFN 3.5 x 3.5 x 0.75 – 14
(T) QFN 4.0 x 4.0 x 0.75 – 16, 20, 24, 28
(T) QFN 5.0 x 4.0 x 0.75 – 18
(T) QFN 5.0 x 5.0 x 0.75 – 24, 32, 40
(T) QFN 5.0 x 6.0 x 0.75 – 28
(T) QFN 5.2 x 6.2 x 0.75 – 32
(T) QFN 6.0 x 6.0 x 0.75 – 40, 48
(T) QFN 7.0 x 7.0 x 0.75 – 48
(T) QFN 8.0 x 8.0 x 0.75 – 56
(T) QFN 9.0 x 9.0 x 0.75 – 64
(T) QFN 13.0 x 13.0 x 0.75 – 108
(UT) QFN 1.6 x 1.6 x 0.5 – 8
(UT) QFN 4.0 x 4.0 x 0.5 – 20
(VT) QFN 2.0 x 2.0 x 0.6 – 12
The Dual / Quad Flat no-leads, also known as (MLF) Micro lead-frame, is a surface-mount technology. These package offer a variety of benefits including reduced lead inductance, a small sized footprint, thin profile and low weight. The exposed cooper die-pad technology offers good thermal and electrical performance. These features make the QFN and DFN an ideal choice for many new applications where size, weight, thermal and electrical performance are crucial.
MEMS Packages
MEMS 14L (WITHOUT PORT)
The MEMS 14L (TPMS) Tire Pressure Monitoring System is an electronics system are designed to monitor the air pressure inside the pneumatic tires on various type of vehicles. The high pressure sensor is enabling to function on real-time and indicate tire-pressure reading to the driver.
MEMS 14L (WITH PORT)
The MEMS 14L also designed for (CPAP) Continuous Positive Airway Pressure Machine. The low pressure sensor is enabling to diagnose, treat or help manage sleep-disordered breathing or other respiratory conditions.
SmartCard / RFID Packages
SMARTCARD
The Smartcard or integrated circuit card (ICC) is a pocket-sized card that has embedded integrated circuits, commonly serve as credit cards or ATM cards. Contact-type smartcard may have many different contact pad layouts design.
RFID
The radio frequency identification (RFID) tags are designed for data/ink cartridges in order to prevent unauthorized refilling of used ink cartridges. RFID is been used in variety applications such as access management, tracking of goods & logistic, airport baggage and etc.
